0-hal
| Halogen-free resins and
laminates for PCBs |
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Content |
Fire bahaviour |
Cost |
| Supplier |
Country |
Resin |
Prepreg |
Laminate |
Type |
N |
Sb |
S |
P |
LOI |
UL-94 |
/FR4 |
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| HITACHI |
Jp |
epoxy |
MCL-RO-67G |
MCL-RO-67G |
FR-4 |
? |
? |
? |
X |
? |
V-0 |
x 2 ? |
| HITACHI |
Jp |
PI |
polyimide |
polyimide |
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/ |
/ |
/ |
/ |
90% |
V-0 |
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| ISOLA |
De |
epoxy |
Duraver E-CU 156 (FR4) |
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FR-4 |
? |
? |
? |
X |
? |
V-0 |
+ 30% |
| ISOLA |
De |
epoxy |
Duraver E-CU 150 (FR5) |
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FR-5 |
X |
? |
? |
X |
? |
V-0 |
x 4 |
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| ISOVOLTA |
At |
Epolac FR5-HF |
Isopreg FR 1179/G-11 |
Isoval FR5-HF |
(1) |
/ |
/ |
/ |
/ |
95% |
V-0 |
+ 20% |
| ISOVOLTA |
At |
Epolac FR5-HF |
Isopreg FR 1179 |
Isoval FR5-HF |
(1) |
/ |
/ |
/ |
/ |
>88% |
V-0 |
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| NAN YA |
Tw |
epoxy ? |
materials under development |
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FR-4 |
? |
? |
? |
? |
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| PARK-NELCO |
UK |
epoxy |
|
N4000-2 EF |
FR-4 |
X |
? |
? |
X |
? |
V-0 |
+ 50% |
| PARK-NELCO |
UK |
epoxy |
under development : |
N4000-6 EF and 13EF |
FR-4 |
X |
? |
? |
X |
? |
V-0 |
+10% |
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| POLYCLAD |
Fr |
epoxy ? |
materials under development |
|
FR-4 |
? |
? |
? |
? |
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| POLYCLAD |
USA |
PI |
polyimide |
polyimide |
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/ |
/ |
/ |
/ |
90% |
V-0 |
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| RESARM |
Be |
epoxy |
Permaglass TE 630 |
Permaglass TE 630 |
CEM3 |
? |
/ |
X |
/ |
? |
(M1) |
- 5% |
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| SUMITOMO |
Jp |
epoxy ? |
materials under development |
|
FR-4 |
? |
? |
? |
? |
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| THERMAGON |
USA |
epoxy |
T-preg 1 KA |
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? |
? |
? |
? |
? |
V-0 |
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| TOSHIBA |
Jp |
epoxy |
TLC-555 |
TLD-152 |
FR-4 |
? |
? |
? |
X |
? |
? |
? |
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(1) |
no copper-clad laminate |
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Last Updated on 10/5/01
By Lindner
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